Chikuma Seiki Enhances Circuit Boards with Precision Rework

In an era of increasingly sophisticated electronics, even the smallest defect on a circuit board can render an entire device inoperable. The precision required in modern electronics manufacturing leaves little room for error, making specialized rework services essential for cost-effective repairs and modifications.

PCB rework refers to the process of repairing or modifying assembled printed circuit boards. When semiconductor components or other electronic parts fail for various reasons, professional rework offers an economical solution compared to complete board replacement. This process involves replacing faulty components, resoldering connections, or modifying circuits to restore functionality while minimizing waste.

Specialized firms offer comprehensive PCB rework services including:

• BGA Rework: Repairing Ball Grid Array components where solder connections are hidden beneath the chip package.
• BGA Reballing: The process of replacing damaged solder balls on BGA components to prepare them for reinstallation.
• Chip Component Replacement: Swapping out surface-mount resistors, capacitors, diodes, and other miniature components.
• Circuit Modifications: Altering board circuitry through trace cuts, jumper wires, or other adjustments to accommodate design changes.

High-quality PCB rework demands specialized equipment and skilled technicians. Advanced rework stations utilize infrared heating systems that precisely target specific board areas without damaging surrounding components. These systems typically accommodate boards up to 560×460mm with component sizes reaching 60×60mm.

Technical teams combine years of experience with rigorous quality control protocols. Post-rework inspections employ X-ray imaging for hidden solder joints and microscopic examination of surface components, ensuring reliable repairs that meet original specifications.

As one of the most complex rework procedures, BGA repair follows a meticulous sequence:

1. Removal: Targeted heating melts solder connections while vacuum tools lift components without board damage.
2. Site Preparation: Meticulous cleaning removes residual solder and flux from connection pads.
3. Reballing: When reusing components, specialized tools precisely position new solder spheres.
4. Alignment: High-magnification systems ensure perfect component-to-pad positioning.
5. Resoldering: Controlled reheating establishes secure electrical and mechanical bonds.
6. Verification: X-ray inspection confirms proper solder joint formation without voids or bridges.

Smaller component replacement follows similarly precise protocols:

• Localized heating removes faulty parts without disturbing adjacent circuitry
• Pad surfaces receive thorough cleaning before new component placement
• Temperature-controlled soldering ensures reliable connections
• Microscopic inspection verifies proper placement and solder quality

Board alterations accommodate design revisions or repair damaged traces:

• Schematic analysis identifies required changes
• Precision cutting tools modify existing traces