WDS-750 High Automation and Precision Digital BGA 3-in-1 Hot Air Soldering Rework Station
Our WDS-750 BGA Rework Station is engineered for precision replacement and repair of BGA chips in laptops, mobile phones, Xbox 360, PS3, and various electronic devices. This advanced system provides an ideal solution for repair shops and electronics factories requiring reliable after-sales service and high-precision rework capabilities.
Featuring optical alignment, triple-zone heating, and ±1°C closed-loop temperature control, the WDS-750 delivers consistent performance for both lead-free and traditional soldering applications.
Operation System
- Manual and semi-automatic modes for flexible operation
- Solder, desolder, pick, place, and replace BGA chips with ±0.01 mm precision
- User-friendly touchscreen interface with optical alignment for fast, accurate rework
Strict Temperature Control System
- 6 heating segments for preheating, soaking, ramping, soldering, reflow, and cooling
- Storage for multiple customized temperature curves
- High-accuracy K-type thermocouple closed-loop control for ±1°C temperature stability
- Four external temperature measurement interfaces for precise detection, analysis, and calibration of real-time soldering temperature curves
Safety System
- CE certified, meeting international safety and quality standards
- Automatic power-off protection device for abnormal accidents
- Dual over-temperature protection to prevent overheating and ensure stable operation
BGA Chip Replacement Process
How to separate BGA chip from motherboard?
How to replace a new BGA chip?
Repair steps:
- Desoldering - Separate the BGA chip from the motherboard using controlled hot air and infrared heating
- Pad Cleaning - Remove solder residue and clean the PCB pads for a smooth surface
- Reballing or Replacement - Reball the original chip or replace it with a new BGA chip
- Alignment/Positioning - Achieve precise positioning using operator experience, silk screen marks, or the WDS-750's HD optical alignment system
- Soldering - Mount and solder the new BGA chip with the triple-zone heating system for consistent reflow quality
Product Parameters
Detailed Images
Packing & Shipping
- Standard Export Wooden Cases
- Delivery within 2 workdays after payment confirmation
- Shipping by TNT, DHL, FEDEX, or by air or by sea
- Loading port: Shenzhen or Hong Kong
Company Information
Shenzhen Wisdomshow Technology Co., Ltd. was founded in 2011 by a team of experienced engineers and sales experts. Specializing in BGA rework stations and X-RAY inspection equipment, the company has grown rapidly through continuous R&D and technological innovation. In 2015, it expanded into the X-RAY field, launching several advanced inspection systems.
Our factory, based in Shenzhen Baoan, covers approximately ten thousand square meters. With ISO9001 and CE certifications, multiple patents, and strong customization capabilities, Wisdomshow serves clients across Asia, Europe, and North America. Our solutions are widely used in server motherboard repair, LED assembly, and smartphone production.
Guided by the principles of professionalism, innovation, and integrity, the company continues to earn global trust and recognition.
Our Advantages and Service
Buyer Feedback
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— Robert, Australia
"I have cooperated with you for many times, your product quality is so great, that is why I still buy the products from you. Thank you."
— Corentin, Brazil
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